中文簡介

《材料力學》是固體力學和材料領(lǐng)域的一本雜志，其目的是在工程和自然材料領(lǐng)域廣泛傳播質(zhì)量研究工作。它報告了原始研究，對從納米到宏觀尺度的子結(jié)構(gòu)進行了機械定向描述，包括隨時間變化和時間無關(guān)的行為、材料不穩(wěn)定性、損傷和斷裂機制，以及力學和電、化學和光學之間的相互作用。重點是檢查應(yīng)變率、時空尺度、微觀結(jié)構(gòu)特征的開始及其演變，以及力學和傳輸現(xiàn)象之間的耦合。該雜志還關(guān)注金屬、聚合物、軟材料、生物材料、天然材料、陶瓷、金屬玻璃、顆粒材料、復(fù)合材料、形狀記憶合金、納米結(jié)構(gòu)材料等的熱-機械本構(gòu)響應(yīng)?；诹W的新興領(lǐng)域研究，如3D打印、添加劑制造，鼓勵使用生物啟發(fā)材料、二維材料，例如石墨烯和薄膜。在上述領(lǐng)域中描述綜合實驗/計算/分析方法的文章也很有趣。為了引起研究者對新力學概念或新材料機制的興趣，促進他們的討論，我們征集了經(jīng)過快速回顧的短篇文章，以便快速傳播。歡迎客座編輯就專題研究領(lǐng)域發(fā)表專題文章，并歡迎新興研究領(lǐng)域的專家發(fā)表評論和調(diào)查，但須經(jīng)編委會批準。

投稿網(wǎng)址：http://ees.elsevier.com/mecmat/

英文簡介

Mechanics of Materials, a journal in the field of solid mechanics and materials, aims to disseminate quality research work in the broad spectrum of engineering and natural materials. It reports original research with a mechanically oriented description of substructures from nano- to macro-scales encompassing time-dependent and time-independent behaviors, material instabilities, damage and fracture mechanisms, and interactions between mechanics and electricity, chemistry and optics. Particular emphasis is placed on the inspection of strain rates, spatio-temporal scales, inception of microstructural features and their evolution, and couplings between mechanics and transport phenomena.The journal also focusses on the thermo-mechanical constitutive response of metals, polymers, soft materials, bio-materials, natural materials, ceramics, metallic glasses, granular materials, composites, shape-memory alloys, nanostructured materials, etc. Mechanics-based investigations on emerging areas such as 3D printing, additive manufacturing, bio-inspired materials, 2D materials, e.g., graphene and thin films, are encouraged. Articles that describe combined experimental/computational/analytical approaches in the above fields are also of interest.To foster interest and promote discussion among researchers on new mechanics concepts or new material mechanisms, short articles which will undergo fast-track review for rapid dissemination are solicited. Special issues on topical research areas by guest editors, review articles and surveys by experts in emerging research fields are also welcome upon approval by the editorial board.