中文簡介

電路世界為電子電路、元件、組裝和產品設計、制造、測試和使用等領域的最新技術、技術論文和社論提供了一個論壇，包括質量、可靠性和安全性。該雜志包括對當今和未來電子技術的各種理論、方法、技術、工藝和應用的多學科研究。該期刊在科學引文索引擴展SCIE（Clarivate Analytics）和Scopus中都排名。電路世界為研究、應用和當前意識提供了全面、權威的信息源。它與研究人員、高級技術人員、供應鏈管理、風險評估和執(zhí)業(yè)工程師有關。電路世界涵蓋了廣泛的主題，包括：電路理論、設計方法、分析與仿真數(shù)字、模擬、微波和光電集成電路半導體、無源、連接器和傳感器零部件、組件和產品的電子包裝印刷電路板設計技術和工藝（控制阻抗、高速印刷電路板、層壓板和層壓、激光加工和鉆孔、成型互連設備、多層板、光學印刷電路板、單面和雙面板、焊接和可焊飾面）X的設計（包括可制造性、質量、可靠性、可維護性、持續(xù)性、安全性、再利用、處置）物聯(lián)網

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英文簡介

Circuit World provides a forum for state of the art, technical papers and editorials in the areas of electronics circuit, component, assembly, and product design, manufacture, test, and use, including quality, reliability and safety. The journal comprises the multidisciplinary study of the various theories, methodologies, technologies, processes and applications relating to todays and future electronics. The journal is ranked in both Science Citation Index Expanded SCIE (Clarivate Analytics) and Scopus. Circuit World provides a comprehensive and authoritative information source for research, application and current awareness purposes. It is relevant to researchers, senior technical staff, supply chain management, risk assessment and practising engineers. Circuit World covers a broad range of topics, including:Circuit theory, design methodology, analysis and simulationDigital, analog, microwave and optoelectronic integrated circuitsSemiconductors, passives, connectors and sensorsElectronic packaging of components, assemblies and productsPCB design technologies and processes (controlled impedance, high-speed PCBs, laminates and lamination, laser processes and drilling, moulded interconnect devices, multilayer boards, optical PCBs, single- and double-sided boards, soldering and solderable finishes)Design for X (including manufacturability, quality, reliability, maintainability, sustainment, safety, reuse, disposal)Internet of Things (IoT)